研磨利器應用:玻璃、陶瓷、鐵氧體、半導體材料、石材等硬脆材料及金屬材料的粗加工，也應用於超硬合金成形加工、電解研削加工。 各種硬脆材料鑽細孔加工如 : 石英、陶瓷、單晶矽、碳化矽、氮化矽、玻璃.光電.量.檢測儀非金屬..等材質

Workpieces:
Crystals, Ceramics, Ferrite, Piezoelectric Elements,Carbon, Metal, Super-Hard Materials, Glass, Copy Mirrors, Photomask, LCD Glass, Glass Disks, Hard Disks, Aluminum Parts, Aluminum Disks, High Precision Aluminum Parts, Silicon Wafers, Oxide Wafers, Compound Wafers
Semiconductor  Piezoelectric Elements, Super-Hard Materials, Etc.